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Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

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Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

Brand Name : WINNER

Model Number : WCBW-5

Certification : ISO 9001, ISO 14001, RoHS

Place of Origin : China

MOQ : 1pc

Price : 1~999

Payment Terms : T/T, Western Union, L/C

Supply Ability : 1000000 rolls per month

Delivery Time : 5~8 working days.

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Bonding Method : Ultrasonic, Thermocompression, Thermosonic

Diameter : 0.01mm - 0.4mm

Material : Copper

Package Weight : 2.2 pounds

Product Type : Bonding Wire

Application : Semiconductor Packaging

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Excellent Electrical Conductivity Ultra Fine wire 0.01 mm Cu Bonding Wire for Semiconductor Packaging

Engineered for high-performance semiconductor packaging, this ultra-fine 0.01mm copper bonding wire delivers excellent electrical conductivity (≤1.7 μΩ·cm) rivaling gold wires at a fraction of the cost. Utilizing a proprietary anti-oxidation nano-coating, it overcomes traditional copper wire limitations, ensuring stable performance in harsh environments (-55°C to 250°C) while preventing corrosion and sulfidation common in humid conditions.
Ideal for high-density interconnects, its 0.01mm diameter enables precise bonding in advanced ICs, MEMS, and power devices, reducing signal loss by 30% compared to standard copper wires. With a tensile strength of ≥3,500 MPa and elongation rates optimized for thermosonic bonding, it minimizes wire sagging and breakage during high-speed assembly, achieving consistent ball diameters (2.8–3.2φ) and loop heights.
ROHS-compliant and halogen-free, this wire cuts packaging costs by 50% versus gold wires while meeting stringent automotive (AEC-Q100) and 5G module reliability standards. Adopted by leading OSATs, it’s the sustainable choice for next-gen EVs, AI chips, and IoT devices demanding cost-efficiency without compromising conductivity.
Winner can provide Copper bonding wire with different wire diameters from 10um-40um according to customer requirements.
Characteristics
* High conductivity
* High tensile strength with high elongation
* Good loop stability
* Significantly reduced formation of intermetallic phases
* Very good ball formation under protective gas
Description of Copper Bonding Wire
The Copper bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Copper bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity.
Applications include:
* Computer : PC, Tablets, Servers & systems, Consumer
* Electronics : Smartphones & phones, TVs, Imaging devices, Wearable electronics
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
Dia EL(%) BL(gf)
mil um 4N 5N 4N 5N
WCBW-1 WCBW-2 WCBW-3 WCBW-4 WCBW-5 WCBW-6 WCBW-7 WCBW-8
0.6 15 3-15 3-15 3-16 3-17 >3.0 >3.0 >3.0 >3.0
0.7 18 3-17 3-17 3-18 4-19 >3.0 >3.0 >3.5 >4.0
0.8 20 4-18 4-18 4-19 5-20 >4.0 >4.5 >5.0 >5.0
0.9 23 6-20 6-20 6-21 6-22 >5.0 >6.0 >6.0 >6.5
1.0 25 8-22 8-23 8-24 8-24 >6.0 >7.0 >7.0 >8.0
1.2 30 9-23 9-24 9-25 9-26 >8.0 >8.5 >8.0 >10.0
1.3 33 9-24 10-25 10-26 10-27 >10.0 >11.0 >10.0 >12.0
1.5 38 10-25 10-26 10-27 11-28 >12.0 >12.0 >12.0 >14.0
1.7 43 10-26 11-28 10-30 11-30 >15.0 >16.0 >15.0 >18.0
2.0 50 12-28 12-30 12-32 12-34 >20.0 >20.0 >20.0 >20.0
The Advantages of Copper Bonding Wire Cost Savings
The relatively low cost of copper is one of the reasons for its appeal as an alternative interconnect material. By replacing gold wires with copper material, thus replacing the precious metal part, significant cost savings are possible. In applications that require increased wire diameters, the usage of copper bears a disproportionately high impact on the saving effect. Superior Performance of Copper Wires Copper exhibits significantly better conductivity than gold or aluminum. Therefore better heat dissipation and increased power ratings are attainable with thinner wire diameters. Copper possesses higher mechanical properties compared to gold. Therefore it displays excellent ball neck strength and high loop stability during molding or encapsulation.

Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging


Product Tags:

0.01 mm Cu Bonding Wire

      

Semiconductor Packaging Bonding Wire

      

Ultra Fine Cu Bonding Wire

      
Quality Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging wholesale

Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging Images

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